EKF - Short Profile
EKF - Short Profile
SC9-TOCCATA

CompactPCI® Serial CPU Card

Tiger Lake Intel® XEON® W (11xxx)
SC9-TOCCATA

Description

Ordering Information

Product Information

Block Diagram

Backplane Resources

Application Notes
Power Event (Power Down)

General Information
CompactPCI® Serial

Low Profile Mezzanine Modules
S20 | S40 | S42 | S48 | S80 | S82

Side Cards
SCJ | SCL | SCZ

Backplane Coupler
SCX | ECX



Firmware

Update

Drivers

Graphics | Ethernet

Photo Gallery


Low Profile Mezzanine Modules

1 | 2 | 3 | 4 | 5

Side Cards

1 | 2

© EKF • Images show up in a secondary browser tab or window


SC9-TOCCATA

CompactPCI® Serial CPU Card

Intel® XEON® W 11xxx (Tiger Lake)


The SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.

The SC9-TOCCATA front panel is provided with three 2.5Gbps Ethernet jacks for networking (2 x TCC/TSN capable) and three 10Gbps USB Type-C receptacles (DisplayPort Alternate Mode enabled) for versatile device and display attachment.

On-board mass-storage solutions are based on low profile mezzanine expansion cards, which accommodate up to two M.2 style SSD modules. One of the M.2 sockets is suitable for a fast NVMe (PCI Express® Gen4 x 4) module.


The SC9-TOCCATA is equipped with up to 64GB DDR4 ECC RAM. Up to 32GB memory-down are provided for rugged applications, and another 32GB are available via the DDR4 ECC SODIMM socket.

The 11th Generation XEON® and Core™ processors are accompanied by the RM590E mobile PCH, for a maximum of high speed I/O resources (e.g. PCI Express®, SATA, USB). Altogether with the processor, 25 PCIe® lanes in total are provided for backplane use, and another 8 lanes for local mezzanine expansion up to PCIe® Gen4 speed.

As an option, up to eight additional Gigabit Ethernet ports (either switch or NICs) are available via the backplane connector P6 by means of a mezzanine module.



SC9-TOCCATA • Photo Soon Here

Feature Summary

    General
  • CompactPCI® Serial (PICMG® CPCI-S.0) CPU Card
  • Form factor single size Eurocard (board dimensions 100x160mm2)
  • Mounting height 3U
  • Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
  • Front panel I/O connectors for typical system configuration (3 x 10Gbps USB Type-C DP Alt Mode, 3 x 2.5Gbps Ethernet RJ45)
  • Backplane communication via PCI Express® Gen3, SATA 6G, USB 3, Gigabit Ethernet
  • On-board PCIe® mezzanine expansion option for mass storage modules or side cards
  • Side cards and low profile mass storage modules available as COTS and also as custom specific

    Processor
  • Intel® 11th Generation Mobile XEON® W or Core™ processor
  • Tiger Lake H45 platform
  • Up to 8-core, up to 3MB cache per core
  • DDR4 3200 ECC RAM
  • Gen 12 graphics, 4 displays up to 8k60
  • TCC/TSN
  • Extended temperature operation
  • Embedded & industrial use conditions
  • 45/35W configurable TDP, 25W TDP
  • BGA soldered for optimum reliability
  • Mobile Intel® Series 500 PCH (RM590E IOTG)
  • Intel® Xeon® W processors (Industrial Use Case *)
  • Up to 8 cores, 24MB cache, 32EU, Intel® vPro™ eligible
  • W-11865MRE | 8c 24M | 4.7GHz | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | -40° C to +100° C
  • W-11555MRE | 6c 12M | 4.5GHz | 45/35W | 32EU 1350MHz | ECC | TCC/TSN | VPro | -40° C to +100° C
  • W-11155MRE | 4c 8M | 4.4GHz | 45/35W | 16EU 1250MHz | ECC | TCC/TSN | -40° C to +100° C
  • W-11865MLE | 8c 24M | 4.5GHz | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | 0° C to +100° C
  • W-11555MLE | 6c 12M | 4.4GHz | 25W | 32EU 1350MHz | ECC | TCC/TSN | VPro | 0° C to +100° C
  • W-11155MLE | 4c 8M | 3.1GHz | 25W | 16EU 1250MHz | ECC | TCC/TSN | 0° C to +100° C
    * disable core/graphics turbo for industrial use condition
  • Intel® Core™ processors (Embedded Use Case)
  • Up to 8 cores, 24MB cache, 32EU, Intel® vPro™ eligible
  • i7-11850HE | 8c 24M | 4.7GHz | 45/35W | 32EU 1350MHz | VPro | 0° C to +100° CC
  • i5-11500HE | 6c 12M | 4.5GHz | 45/35W | 32EU 1350MHz | VPro | 0° C to +100° C
  • i3-11100HE | 4c 8M | 4.4GHz | 45/35W | 16EU 1250MHz | 0° C to +100° C
  • 6600HE | 2c 8M | 2.6GHz | 35W | 16EU 1100MHz | 0° C to +100° C

    Firmware
  • Phoenix® UEFI (Unified Extensible Firmware Interface)
  • Fully customizable by EKF
  • Secure Boot and Measured Boot supported
  • Windows®, Linux and other (RT)OS' supported
  • Intel® AMT supported (disabled by default, must be enabled via BIOS setup)

    Main Memory
  • Integrated memory controller up to 64GB DDR4 3200 with hardware ECC *
  • DDR4 +ECC soldered memory up to 32GB (ultra rugged basic memory)
  • DDR4 +ECC SO-DIMM memory module socket up to 32GB (memory expansion option)
  • Total memory encryption
    * ECC with XEON® processor SKUs (industrial use)

    Graphics
  • Integrated graphics engine, 4 displays
  • Codec support HEVC/SCC/VP9/AV1
  • HDR support power optimized
  • Decode up to 8k60:
  • 2x 4k60 8b 4:2:0 AVC
  • 5k60 12b 4:2:2/4:4:4 HEVC/VP9/SCC
  • 8k60 12b 4:2:0 HEVC/VP9/SCC
  • 4k60 10b 4:2:0 AV1
  • Encode up to 8k30:
  • 2x 4k60 8b 4:2:0 AVC
  • 5k60 10b 4:4:4 HEVC/VP9/SCC
  • 8k30 10b 4:2:0 HEVC/VP9/SCC
  • 2x 4k HEVC encode speed
  • Up to 4 displays supported:
  • 1 Display: 8k60 HDR
  • 2 Displays: 8k60 SDR or 4k120 HDR + 5k120 HDR
  • 3 Displays: 4k60 HDR
  • 4 Displays: 4k60 HDR
  • DisplayPort DP1.4a HBR3
  • Multi-Stream Transport (MST) - display daisy chaining
  • Integrated DP Alt Mode MUX
  • Integrated audio
  • Display front panel options:
  • 3 x Type-C connectors (DisplayPort Alternate Mode)
  • 4th DisplayPort optional via Type-C connector on low profile mezzanine card S40 or S48

    Networking
  • Up to 11 Gigabit Ethernet networking interfaces in total
  • 3 x Front 2.5GBASE-T RJ45 - 3 x Intel® I225-IT NIC
  • 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T connections
  • RJ45 Front port 1 - Intel® I225-IT, Intel® vPRO™/AMT (Wake on LAN)
  • RJ45 Front port 2 - Intel® I225-IT, TCC/TSN capable, PPS/PPM
  • RJ45 Front port 3 - Intel® I225-IT, TCC/TSN capable
  • Integrated TCC/TSN controller for front ports 2 & 3 (RM590E PCH) - Real Time networking
  • TSN Precision time protocol (Time-Sensitive-Networking) as required e.g. for OPC UA and OpenAvnu
  • Enables ultra-reliable low-latency communication (URLLC)
  • Intel® Time Coordinated Computing (Intel® TCC) for time synchronisation and timeliness
  • Option 8 x 1000BASE-T backplane w. S80-P6 mezzanine module - Marvell® Peridot switch
  • Option 4 x 1000BASE-T backplane w. S82-P6 mezzanine module - 4 x Intel® I210-IT NIC
  • Option 4 x 2500BASE-T RJ45 front w. SCJ-VEENA short side card - 4 x Intel® I225-IT NIC (8HP assy)
  • Option 4 x 1000BASE-T M12-X front w. SCL-RHYTHM short side card - 4 x Intel® I210-IT NIC (8HP assy)

    Security
  • Total memory encryption - hardware based
  • ROP attack prevention - hardware based protection against browser malware attacks
  • Advanced Crypto Key protection - hardware based
  • Trusted Platform Module SLM9670
  • TPM 2.0 for highest level of certified platform protection
  • Infineon Optiga™ cryptographic processor
  • Conforming to TCG 2.0 specification

    Front Panel I/O (4HP)
  • 3 x 2.5 Gigabit Ethernet RJ45 receptacles
  • (2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-Te)
  • Intel® vPRO™/AMT support
  • 3 x DisplayPort (Type-C Alt Mode)
  • Port 2 & 3 TCC/TSN enabled
  • 3 x 10Gbps USB Type-C receptacles DisplayPort Alt Mode
  • USB and/or DisplayPort usage
  • USB 3.2 Gen 2x1 (formerly USB 3.1 Gen2) SuperSpeed+ 10Gbps
  • DisplayPort 1.4
  • Additional Type-C front I/O with low profile mezzanine S40 or S48

    Front Panel I/O (8/12HP)
  • Variety of side cards available, common front panel 8HP/12HP with CPU card
  • For backplanes with system slot right aligned
  • Various I/O ports e.g. UART, Audio, RJ45 Ethernet, M12-X Ethernet, Wireless (SMA)
  • Custom specific front panel and side card design

    CompactPCI® Serial Backplane Resources
  • PICMG® CPCI-S.0 CPU card & system slot controller
  • 16 x PCIe Gen3 1 8GT/s (2 links x8 for two fat pipe slots, derived directly from the Xeon® or Core™ CPU)
  • 9 x PCIe Gen3 8GT/s (1 link x4, 5 links x1 for peripheral slots, derived from the PCH)
  • 5 x SATA 6G (from the PCH)
  • 8 x USB3 2 (from the PCH)
  • Option 8 x Gigabit Ethernet Marvell 88E6390 switch (S80-P6 low profile mezzanine expansion card)
  • Option 4 x Gigabit Ethernet Intel® I210-IT NIC (S82-P6 low profile mezzanine expansion card)
    1 The CPU is PCIe® Gen4 capable on these links (not specified for CompactPCI® Serial)
    2 USB 3.2 Gen 2x1 SuperSpeed+ 10Gbps

    Local Expansion
  • Mezzanine side card connectors for optional local expansion
  • Low profile mezzanine modules available (4HP front panel)
  • Side cards available (8HP F/P assembly)
  • HSE1 - PCIe Gen4 x4, 1 x USB3 10Gbps & 2 x USB2
  • HSE2 - PCIe Gen3 x4 (configurable also 2x2, 4x1), 4thDisplayPort
  • EXP - Legacy interface (eSPI, Audio, UART, I2C, GPIO)
  • 4HP Low profile mezzanine module options (to be ordered separately)
  • S20-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x Type-C
  • S40-NVME Mezzanine module - 1 x M.2 2280 NVME SSD socket, 1 x M.2 2280 SATA SSD socket, 2 x Type-C
  • S42-MC Mezzanine module - 1 x M.2 2280 NVME SSD socket, 2 x Mini Card sockets
  • S48-SSD Mezzanine Module - 2 x M.2 2280 NVME SSD sockets, 1 x Type-C
  • S80-P6 Mezzanine module - 1 x M.2 2280 NVMe SSD socket, 8 x Gigabit Ethernet via P6 backplane connector
  • S82-P6 Mezzanine module - M.2 NVMe SSD & 4 x GbE NIC via P6 backplane connector
  • Custom specific storage & I/O module design
  • 8HP Mezzanine side card options (to be ordered separately)
  • SCJ-VEENA Short side card - M.2 2280 NVMe SSD socket, 4 x 2.5GbE NIC, front panel RJ45, USB3
  • SCL-RHYTHM Short side card - M.2 2280 NVMe SSD socket, 4 x GbE NIC, front panel M12-X
  • SCX-PCIE - M.2 2280 NVMe/SATA SSD socket, PCIe® Mini Card socket, 3 x USB3, 3 x GbE RJ45 connectors, coupler for secondary CompactPCI® Serial backplane
  • SCZ-NVM - M.2 22110 NVMe SSD socket, quad UART, DisplayPort & USB3 connectors
  • ECX-PCIE - Front I/O same as SCX, coupler for CompactPCI® Express secondary backplane
  • Custom specific side card design - I/O and storage

    RT OS Board Support Packages
  • Available on request

    Applications
  • High performance industrial and embedded computing, for x86 based software
  • Automation, process control, test systems, demanding applications

    Environmental & Regulatory
  • Designed & manufactured in Germany
  • ISO 9001 certified quality management
  • Long term availability
  • Rugged solution
  • Coating, sealing, underfilling on request
  • Lifetime application support
  • RoHS compliant
  • EC Regulatory EN55024, EN55032, EN62368-1
  • Operating temperature -40°C to +85°C (industrial temperature range)
  • Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
  • Humidity 5% ... 95% RH non Condensing
  • Altitude -300m ... +3000m
  • Shock 15g 0.33ms, 6g 6ms
  • Vibration 1g 5-2000Hz
  • MTBF tbd years

SC9-TOCCATA • Simplified Block Diagram

SC9-TOCCATA • Simplified Block Diagram
Ordering Information
Please refer to List 21 for popular SKUs